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Wangling F4BTMS220 DK2.20 Df0.0009 (More than 0.09mm) Copper Clad Laminate
Brief Introduction
F4BTMS220 is an advanced ceramic-filled PTFE laminate reinforced with ultra-thin fiberglass cloth, designed for high-reliability RF and microwave printed circuit board applications. As an upgraded version of the F4BTM series, it offers enhanced dielectric stability, low loss, and excellent thermal performance, making it suitable for aerospace, military, and high-frequency electronic systems.
Technical Features & Benefits
Low and Stable Dielectric Constant: Dk = 2.20 ±0.02 at 10 GHz, with excellent consistency between batches.
Ultra-Low Loss: Dissipation factor as low as 0.0009 at 10 GHz, ensuring minimal signal attenuation.
Excellent Frequency Stability: Stable Dk and loss values up to 40 GHz, suitable for phase-sensitive applications.
Low Thermal Expansion: CTE in XY direction: 40–50 ppm/°C, Z direction: 290 ppm/°C, ensuring dimensional stability.
High Thermal Conductivity: 0.26 W/(m·K) in Z direction for improved heat dissipation in power applications.
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Typical Properties:
| Property |
Test Condition |
Unit |
F4BTMS220 |
| Dielectric Constant (Typ.) | 10 GHz | – | 2.20 |
| Dk Tolerance | – | – | ±0.02 |
| Design Dk | 10 GHz | – | 2.20 |
| Loss Tangent (Typ.) @10 GHz | 10 GHz | – | 0.0009 |
| Loss Tangent (Typ.) @20 GHz | 20 GHz | – | 0.0010 |
| Loss Tangent (Typ.) @40 GHz | 40 GHz | – | 0.0013 |
| TC of Dk | –55°C to 150°C | ppm/°C | –130 |
| Peel Strength (1 oz RTF) | RTF Copper | N/mm | >2.4 |
| Volume Resistivity | Ambient | MΩ·cm | ≥1×10⁸ |
| Surface Resistivity | Ambient | MΩ | ≥1×10⁸ |
| Dielectric Strength (Z) | 5 kV, 500 V/s | kV/mm | >26 |
| Breakdown Voltage (XY) | 5 kV, 500 V/s | kV | >35 |
| CTE (XY) | –55°C to 288°C | ppm/°C | 40–50 |
| CTE (Z) | –55°C to 288°C | ppm/°C | 290 |
| Water Absorption | 20±2°C, 24 h | % | 0.02 |
| Density | Ambient | g/cm³ | 2.18 |
| Operating Temperature | – | °C | –55 to +260 |
| Thermal Conductivity (Z) | Z-direction | W/(m·K) | 0.26 |
| Flammability | – | UL 94 | V-0 |
| Composition | – | – | PTFE, Ultra-Thin Quartz Fiberglass, Ceramic Fillers |
Application Areas
Aerospace & Avionics: Spacecraft onboard systems, cabin equipment.
Military Radar: Phased array antennas, radar systems.
RF & Microwave Circuits: Low-loss amplifiers, filters, couplers.
Satellite Communications: Feed networks, high-frequency transceivers.
Phase-Sensitive Antennas: Where stable Dk and low loss are critical.
Available Configurations:
Copper Foil: Standard RTF low-profile copper, 0.5 oz and 1 oz thicknesses.
Panel Sizes: 305×460 mm, 460×610 mm, 610×920 mm.
Thickness Range: From 0.090 mm (3.5 mil) upward, with tight tolerances.
Metal-Clad Options: Aluminum or copper-backed versions available (F4BTMS220–AL/CU).
Special Options: 50 Ω embedded resistor foil for resistive layer designs.
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